Industrial electronics packaging is the collection of materials, enclosures and engineering practices that protect, interconnect, cool and enable electronic assemblies for use in industrial environments covering printed-circuit-board (PCB) substrates, component-level encapsulation (underfill, potting, conformal coating), module and system housings, thermal management (heatsinks, TIMs, liquid cooling), electromagnetic-interference (EMI) shielding, and ruggedized connectors and seals.